Semiconductor and IC Packaging Materials

Semiconductor and IC Packaging Materials
Global Semiconductor and IC Packaging Materials Market to Reach $72.8 Billion by 2030
The global market for Semiconductor and IC Packaging Materials estimated at US$28.5 Billion in the year 2022, is projected to reach a revised size of US$72.8 Billion by 2030, growing at a CAGR of 12.4% over the period 2022-2030. Organic Substrates, one of the segments analyzed in the report, is projected to record 13.4% CAGR and reach US$22 Billion by the end of the analysis period. Growth in the Bonding Wires segment is estimated at 14.5% CAGR for the next 8-year period.

The U.S. Market is Estimated at $1.9 Billion, While China is Forecast to Grow at 14.5% CAGR
The Semiconductor and IC Packaging Materials market in the U.S. is estimated at US$1.9 Billion in the year 2022. China, the world`s second largest economy, is forecast to reach a projected market size of US$17.6 Billion by the year 2030 trailing a CAGR of 14.5% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 10.9% and 6.9% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 9.4% CAGR.Select Competitors (Total 106 Featured) - BASF SE3M CompanyAnalog Devices, Inc.Amkor Technology, Inc.ams AGAtotech Deutschland GmbHCanatu OyAdtech CeramicsCarsem (M) Sdn. Bhd.Ceramtec GmbHChaozhou Three-Circle (Group) Co., Ltd.AMETEK Electronic Components & PackagingChipbond Technology CorporationCalifornia Fine Wire Co.Amtech Microelectronics, Inc.Please note: Reports are sold as single-site single-user licenses. Electronic versions require 24-48 hours as each copy is customized to the client with digital controls and custom watermarks. The Publisher uses digital controls protecting against copying and printing is restricted to one full copy to be used at the same location.

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