Semiconductor Advanced Packaging

Semiconductor Advanced Packaging
Global Semiconductor Advanced Packaging Market to Reach $68 Billion by 2030
The global market for Semiconductor Advanced Packaging estimated at US$35.8 Billion in the year 2022, is projected to reach a revised size of US$68 Billion by 2030, growing at a CAGR of 8.3% over the period 2022-2030. Flip Chip Packaging, one of the segments analyzed in the report, is projected to record 7.9% CAGR and reach US$49.1 Billion by the end of the analysis period. Growth in the 2.5d/3d Packaging segment is estimated at 10.9% CAGR for the next 8-year period.

The U.S. Market is Estimated at $3.3 Billion, While China is Forecast to Grow at 9.8% CAGR
The Semiconductor Advanced Packaging market in the U.S. is estimated at US$3.3 Billion in the year 2022. China, the world`s second largest economy, is forecast to reach a projected market size of US$19.9 Billion by the year 2030 trailing a CAGR of 9.8% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 5.9% and 6.8% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 6.1% CAGR.Select Competitors (Total 109 Featured) - Advanced Micro Devices, Inc.Applied Materials, Inc.Avery Dennison CorporationAmkor Technology, Inc.Advantest CorporationBrewer Science, Inc.American Semiconductor, Inc.ASM Pacific Technology Ltd.ASE Technology Holding Co., Ltd.AT & S Austria Technologie & Systemtechnik AGBE Semiconductor Industries N.V.Amtech Microelectronics, Inc.APSTLBoschman TechnologiesASE KoreaPlease note: Reports are sold as single-site single-user licenses. Electronic versions require 24-48 hours as each copy is customized to the client with digital controls and custom watermarks. The Publisher uses digital controls protecting against copying and printing is restricted to one full copy to be used at the same location.

The latest version of Adobe Acrobat Reader is required to view the report. Upon ordering an electronic version, the Publisher will provide a link to download the purchased report.

Prior to fulfillment of an order, the client will be required to sign a document detailing the purchase terms for a publication from this publisher.