Radiation-Hardened Electronics Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028

Radiation-Hardened Electronics Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028

The global radiation-hardened electronics market size reached US$ 1.3 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 1.6 Billion by 2028, exhibiting a growth rate (CAGR) of 2.9% during 2023-2028.

Radiation-hardened electronics refer to various electronic components, packages and products that are primarily used for high-altitude applications. The materials used for the manufacturing of such components include silicon, silicon carbide, gallium nitride and hydrogenated amorphous silicon. These components are resistant to the damage caused by ionizing and high-energy radiations, and gamma and neutron radiation emitted by nuclear reactors. They are widely employed in satellites, aircraft and nuclear power plants in the form of switching regulators, microprocessors and power supply devices. Owing to this, they find extensive applications across various industries, including aviation, space, military and defense.

The global market is primarily being driven by the increasing number of space missions and exploratory activities. In line with this, the rising demand for communication satellites for intelligence, surveillance and reconnaissance (ISR) operations is also providing a boost to the market growth. Radiation-hardened electronics is crucial for protecting electronic equipment from physical damage and failure caused by harmful radiations in outer space. Furthermore, widespread product adoption for manufacturing power management devices is creating a positive impact on the market. These electronics are also used to manufacture diodes, transistors and metal-oxide-semiconductor field-effect transistors (MOSFET) for various defense and military applications. Additionally, various technological advancements, such as the development of highly reliable integrated circuits and improvements in the field-programmable gate array (FPGA) technology, are creating a positive outlook for the market. Other factors, including significant growth in the electronics industry and extensive research and development (R&D) activities, are projected to drive the market further.

Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global radiation-hardened electronics market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on product type, material type, technique, component type and application.

Breakup by Product Type:

Custom Made
Commercial-Off-the-Shelf

Breakup by Material Type:

Silicon
Silicon Carbide
Gallium Nitride
Others

Breakup by Technique:

Radiation Hardening by Design (RHBD)
Radiation Hardening by Process (RHBP)
Radiation Hardening by Software (RHBS)

Breakup by Component Type:

Power Management
Application Specific Integrated Circuit
Logic
Memory
Field-Programmable Gate Array
Others

Breakup by Application:

Space Satellites
Commercial Satellites
Military
Aerospace and Defense
Nuclear Power Plants
Others

Breakup by Region:

North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa

Competitive Landscape:
The report has also analysed the competitive landscape of the market with some of the key players being Analog Devices Inc., BAE Systems plc, Cobham Plc (Advent International), Data Device Corporation (Transdigm Group Incorporated), Honeywell International Inc., Microchip Technology Inc, STMicroelectronics, Texas Instruments Incorporated, The Boeing Company, Xilinx Inc., etc.

Key Questions Answered in This Report:
How has the global radiation-hardened electronics market performed so far and how will it perform in the coming years?
What are the key regional markets?
What has been the impact of COVID-19 on the global radiation-hardened electronics market?
What is the breakup of the market based on the product type?
What is the breakup of the market based on the material type?
What is the breakup of the market based on the technique?
What is the breakup of the market based on the component type?
What is the breakup of the market based on the application?
What are the various stages in the value chain of the industry?
What are the key driving factors and challenges in the industry?
What is the structure of the global radiation-hardened electronics market and who are the key players?
What is the degree of competition in the industry?