Global Radiation-hardened Electronics Market 2023-2027

Global Radiation-hardened Electronics Market 2023-2027

Technavio has been monitoring the radiation-hardened electronics market and is forecast to grow by $340.35 mn during 2022-2027, accelerating at a CAGR of 4.02% during the forecast period. Our report on the radiation-hardened electronics market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by the rising need for radiation-hardened electronics in space applications, growing satellite missions, and growing surveillance and reconnaissance.

Technavio's radiation-hardened electronics market is segmented as below:

By Product TypeCustom madeCommercial-off-the-shelf (COTS)By ComponentPower managementMixed signal ICsProcessors and controllersMemoryBy GeographyNorth AmericaEuropeAPACSouth AmericaMiddle East and AfricaThis study identifies product launches as one of the prime reasons driving the radiation-hardened electronics market growth during the next few years. Also, strategic partnerships and acquisitions and growing focus on radiation-hardened electronics research will lead to sizable demand in the market.

Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters. Our report on the radiation-hardened electronics market covers the following areas:Radiation-hardened electronics market sizingRadiation-hardened electronics market forecastRadiation-hardened electronics market industry analysisTechnavio's robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading radiation-hardened electronics market vendors that include Advanced Micro Devices Inc., Aitech, Amphenol Corp., Analog Devices Inc., BAE Systems Plc, Data Device Corp., Everspin Technologies Inc., Frontgrade Technologies, GSI Technology Inc., HEICO Corp., Honeywell International Inc., Infineon Technologies AG, Mercury Systems Inc., Microchip Technology Inc., Renesas Electronics Corp., Space Micro Inc., STMicroelectronics NV, Teledyne Technologies Inc., Texas Instruments Inc., and TTM Technologies Inc. Also, the radiation-hardened electronics market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. Technavio's market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.