3D TSV Devices

3D TSV Devices
Global 3D TSV Devices Market to Reach $27.7 Billion by 2030
The global market for 3D TSV Devices estimated at US$5.9 Billion in the year 2022, is projected to reach a revised size of US$27.7 Billion by 2030, growing at a CAGR of 21.3% over the period 2022-2030. Memory, one of the segments analyzed in the report, is projected to record 20.7% CAGR and reach US$8 Billion by the end of the analysis period. Growth in the Mems segment is estimated at 22.5% CAGR for the next 8-year period.

The U.S. Market is Estimated at $954.3 Million, While China is Forecast to Grow at 25.1% CAGR
The 3D TSV Devices market in the U.S. is estimated at US$954.3 Million in the year 2022. China, the world`s second largest economy, is forecast to reach a projected market size of US$8.4 Billion by the year 2030 trailing a CAGR of 25.1% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 16.2% and 17.8% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 16.2% CAGR.Select Competitors (Total 68 Featured) - IBM CorporationDai Nippon Printing Co., Ltd.Amkor Technology, Inc.ASM Pacific Technology Ltd.Globalfoundries, Inc.Himax Technologies, Inc.ASE Technology Holding Co., Ltd.FRT GmbHGS NanotechGalaxyCore Inc.Gpixel, Inc.Heliotis AGHill Technical Sales CorporationCORIALGuangdong OPPO Mobile Telecommunications Corp., Ltd.Please note: Reports are sold as single-site single-user licenses. Electronic versions require 24-48 hours as each copy is customized to the client with digital controls and custom watermarks. The Publisher uses digital controls protecting against copying and printing is restricted to one full copy to be used at the same location.

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